2D Heterostructure Transfer System
2D Heterostructure Transfer System
The 2D Heterostructure Transfer System is a precision alignment platform built for stacking two-dimensional materials into van der Waals heterostructures. It combines a temperature-controlled sample stage, motorized XY positioning, high-resolution rotational alignment, and a cantilever-based pick-up mechanism with sub-micron control accuracy — enabling clean, deterministic dry transfer of exfoliated flakes and CVD films.
With in-situ optical alignment throughout the transfer process, the system is ideal for assembling twisted bilayers, hBN-encapsulated devices, and multi-layer heterojunction stacks used in 2D electronics, optoelectronics, and quantum device research. Three control modes — computer software, hand-held controller, and full manual operation — let you move seamlessly between automated routines and hands-on fine adjustment.
Specifications
| Sample stage | Temperature range: ambient to 200 °C; control accuracy 0.5 °C |
| Cantilever XY stage | 20 mm travel; positioning accuracy < 1 μm |
| Sample table XY stage | 20 mm travel; positioning accuracy < 1 μm |
| Rotation stage | 360° continuous rotation; angular accuracy < 0.01° |
| Cantilever lift (Z) axis | Electric + manual dual drive; 20 mm stroke; electric positioning accuracy < 0.5 μm |
| Field-of-view XY adjustment | 25 mm travel (coarse positioning) |
| Control modes | PC software / hand-held controller / manual |
Configuration options
Standard: cantilever lift (Z axis) with electric + manual dual drive, 20 mm stroke and < 0.5 μm electric positioning accuracy; all other specifications as listed above.
High-precision (optional): cantilever lift (Z axis) with electric + manual dual drive, 10 mm stroke and < 0.1 μm electric positioning accuracy; all other specifications as listed above.
Contact us for a quotation on either configuration.
Trusted by leading research institutions worldwide
Our transfer systems are used by 2D materials research groups at Harvard University, Massachusetts Institute of Technology (MIT), Boston University, Boston College, University of Pennsylvania, Stanford University, Cornell University, University of Cambridge, Nanyang Technological University, National University of Singapore, Tsinghua University, Peking University, Nanjing University, Max Planck Institute, and University of Ottawa, among others.
